SparkNano is a high-tech product company that designs and commercializes Spatial Atomic Layer Deposition (Spatial ALD) tools, enabling its customers to deposit high throughput nano scale coatings.
Spatial ALD expands the capability of ALD by introducing spatial separation between the precursor and the co-reactant. Instead of depositing the precursors directly on the substrate in a sequential manner, they are kept physically separated in space. This enables a faster and more flexible deposition.
Using our Spatial ALD technology and tools, we offer coatings with a variety of materials, including Al, Ir, IrOx, Pt, SiO2, TiO2, ZnO, and many more, depending on the application and specific requirements. We also provide in-house sampling on our Spatial ALD tool to test and validate customer requests and concepts. For more information on deposition possibilities, please contact us at info@spark-nano.com.
The Spatial ALD coating is chemically bonded to the substrate, resulting in a very strong and durable attachment. This chemical bonding process ensures that the coating adheres at the molecular level, providing superior adhesion compared to other deposition technologies, such as Physical Vapor Deposition (PVD) or Chemical Vapor Deposition (CVD).
Our Spatial ALD technology operates at atmospheric pressure for coating. This allows for a more efficient and cost-effective process, eliminating the need for vacuum systems typically required in other deposition methods. Coating at atmospheric pressure also simplifies the setup and maintenance of the equipment, making it more suitable for large-scale and continuous production.
Yes, Spatial ALD can coat a variety of substrates, including planar, porous, and flexible materials such as polymers, plastics, and foils. Its versatility allows for effective application of coatings on different surface types, ensuring high-quality and durable results.
No, Spatial ALD cannot coat powders or particles directly. However, if the powders or particles are fixed onto a substrate like foil, we can deposit coatings on them effectively.
Spatial Atomic Layer Deposition (Spatial ALD) is a thin-film deposition technique that enables precise and uniform coating of substrates with atomic-level control over film thickness and composition. Spatial ALD expands the capability of ALD by introducing spatial separation between the precursor and the co-reactant. Instead of depositing the precursors directly onto the substrate in a sequential manner, they are kept physically separated in space. This approach allows for faster and more flexible deposition processes.
In Spatial ALD, each cycle deposits a precise atomic layer or a sub-nanometer thickness of material. The actual thickness achieved depends on the specific materials being deposited and the number of deposition cycles performed.
No, we do not utilize vacuum processes in our operations. Instead, Spatial ALD operates under atmospheric conditions, facilitating efficient and precise thin-film deposition on various substrates without the need for vacuum chambers.
